Swing Cathode™ and MC end block available in compact versions
Sputtering Components’ popular Swing Cathode™ and MC end block are now both available in compact designs.
The new CM Swing Cathode™ (left) has a smaller footprint, which allows for more flexibly in vacuum chamber design and for more cathodes in a system. It was especially developed to serve the needs of the semiconductor market as well as segments of the display and decorative coatings markets, said Chaffee Tran, New Business Development Manager at SCI.
“The adoption of this technology will help to drive the reduction in packaging costs in processing and miniaturization of electronic components.”
Used with cylindrical targets and static substrates, Swing Cathodes™ have a magnetron with a programmable swing motion. The magnetron rotates from side to side independently of the target rotation, making Swing Cathodes™ ideal for 3D part coating.
Cost reductions with the Swing Cathode™ are due to increased uptime because the cylindrical target used requires fewer target changes and allows for faster target changes when compared to planar targets. Furthermore, deposition rates can be higher due to more efficient cooling, and yield is better because particle generation is less. There is also a cost savings related to target utilization and capital expense as substrate sizes begin to scale beyond 1 m.
The CM Swing Cathode™ has a cantilever capability to support 80-mm-ID targets as long as 1 m and 125-mm-ID targets up to 0.65 m. Non-proprietary targets can be used, allowing more sourcing choices.
Similar to its big brothers, the SM Swing Cathode™ and the MM Swing Cathode™, the new CM Swing Cathode™ uses an end block that mounts on the vacuum chamber exterior. All utilities remain attached for a quick and easy target changeover.
For use with Swing Cathodes™, SCI’s Swing-DUO™ (Dynamic Uniformity Optimization) software simulates and optimizes the motion profile used to control SCI magnet bar movement.
The new cMC end block (right) is designed for retrofit from other manufactures’ compact end blocks. For mounting inside the vacuum chamber, the cMC has a width about 20 percent thinner than SCI’s MC while keeping the same power rating and ability to handle targets up to 2500 mm long.
Both the CM Swing Cathode™ and the cMC end block have SCI’s patented brushless power delivery system and patented water fill/drain feature. The brushless design eliminates brush dust and the need to replace brushes while the fill/drain feature further decreases the time required to change targets and keeps the coater dry during target changes.
Both new products also have long-life rotary seals. They are designed for quick and easy in-house maintenance and never have to be sent back to the factory for overhaul or repair.
For more information about how the CM Swing Cathode™ or the cMC end block can improve your thin film coating process, please contact us.
